Qualcomm Snapdragon Tech Summit 2017 is up and running from 5th December to 7th December. In this time frame of 48 hours, the US-based chipset manufacturer will showcase the upcoming technologies, which are developed by the brand in last few months. One of the most exciting things, for the tech enthusiasts, is the Qualcomm’s next-generation flagship ARM-based processor, in Qualcomm’s term the next Mobile Solution for the flagship smartphones.
So, finally, the company unveiled that, they have finalised the name of the processor and the successor goes by the name Qualcomm Snapdragon 845. The company haven’t spoken much about the processor, but, the company have given few hints and expected to announce a full set of features on the last day of the summit.
Compared to the Qualcomm Snapdragon 835, the 845 will offer better cinema quality 360 video recording capability, better battery life, dedicated cores to perform tasks like virtual reality and augmented reality. Built-in security with chip-level encryption for better online privacy. Of course, this chipset will offer better CPU and GPU performances compared to the current flagship processor, the Qualcomm Snapdragon 835.
The first major OEM to make an open statement about the chipset regarding the implementation is Xiaomi’s CEO Lei Jun, here are the exact words that he said regarding the same:
“Xiaomi is committed to making devices that combine cutting-edge innovations in technology and beautiful design while defying price expectations, and we have chosen Snapdragon 845 to power our next flagship smartphone,”
Like always, the chipset will be manufactured by (mass produced) Samsung and this will not only benefit Qualcomm, it also gives an opportunity for the Samsung to use the freshly baked cookies to be used on their serving (talking about the Samsung Galaxy S9 and S9+). Here is the official comment from the company regarding the same:
“Samsung Foundry will be the foundry for Snapdragon 845 as the Companies continue to work together to advance the silicon manufacturing process,”
If we look at the known amount of information, the Qualcomm Snapdragon 845 will have better network capabilities, compared to the Apple’s A11 Bionic Processor (which uses Qualcomm X16 LTE model) and the Snapdragon 845 is packed by a newer Qualcomm X20 LTE modem with faster wireless data transfer speeds. The processor will be manufactured by the same 10 nm FinFET technology, so, one can expect similar thermal efficiency as that of the Snapdragon 835.
Finally, the Qualcomm Snapdragon 845 packs a new Adreno 550 GPU, which should offer more raw power compared to the Adreno 540 found on the Qualcomm Snapdragon 835. However, one has to wait to see how well it can perform against the Apple A11 Bionic’s custom GPU designed by Apple.