Qualcomm’s tier 2 processor, the Qualcomm Snapdragon 670 was spotted online. Thanks to Ronald Quandt, we have complete information about the forthcoming chipset, which will power the premium mid-tier smartphones costing ₹25,000 to ₹30,000 price bracket.
The Qualcomm Snapdragon 670 is fabricated by the same 10 nm FinFET architecture, in fact, this is the most advanced and the energy efficient way to manufacture the mobile processor as the Qualcomm Snapdragon 835, Qualcomm Snapdragon 845, Exynos 8895, and the Hisilicon Kirin 970 processors use the same technology. So, according to Quandt, the chipset will offer 8 cores with Little Big architecture with 4 performing cores and 4 efficiency cores. These cores will be based on the custom Kyro 260 architecture like the Qualcomm Snapdragon 660 Octa-core processor. This chipset will be manufactured by Samsung like the tier 1 chipsets.
Qualcomm testing new Snapdragon 670 (SDM670) – their test platform has
4/6 GB LPDDR4X RAM
64 GB eMMC 5.1 flash storage
22,6 + 13 MP camera.
— Roland Quandt (@rquandt) December 20, 2017
This specific chipset supports either 4 GB or 6 GB LPDDR4x RAM with 64 GB eMMC 5.1 flash storage paired with a maximum of WQHD screen resolution. So, this processor can easily drive a QHD+ display without any hassle. in terms of camera capability, this specific processor can support up to 22.9 MP rear-facing camera and a 13 MP front-facing camera (maximum resolution) with 4K video recording capability and dual ISP (image sensing processor).
Like the 660, the Qualcomm Snapdragon 670 will support dual-band WiFi (2.4 GHz and 5.0 GHz) with Bluetooth 5.0, NFC and 4G LTE and with VoLte capability. In terms of LTE speeds, this chipset might offer support for the Gigabit LTE with up to 1.2 Gbps download speeds and upload speed. Other standard features like NFC, Qualcomm Quick charge 4.0 are also included in this specific processor.
If everything goes accordingly, the chipset manufacturer will unveil the processor in Q1 of 2018, so, the smartphone makers can implement the same in the upcoming smartphone after that. The company might give a hint about the same in the upcoming CES 2018, which will be held in January 2018.
Recently Qualcomm had launched the Qualcomm Snapdragon 845 Octa-core flagship class processor, which dethrone the Qualcomm Snapdragon 835. The Snapdragon 845 comes with an overall improvement over the predecessor with up to 35 percent of GPU and CPU improvement with next-generation image sensors with the ability to capture a lot of colours and details like none of the current smartphones in the market. Few smartphone makers have already partnered with the chipset manufactures. Xiaomi is the first smartphone maker to officially announced the implementation of the chipset on its upcoming flagship smartphone AKA, the Xiaomi Mi 7.